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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6028 Issued Date : 1997.06.24 Revised Date : 2001.11.01 Page No. : 1/3 HJ10387 NPN EPITAXIAL PLANAR TRANSISTOR Description The HJ10387 is designed for general purpose amplifier and low speed switching applications. Absolute Maximum Ratings (Ta=25C) TO-252 * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (Tc=25C) ..................................................................................... 20 W Total Power Dissipation (Ta=25C) ....................................................................................... 2 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage....................................................................................... 80 V BVCEO Collector to Emitter Voltage.................................................................................... 80 V BVEBO Emitter to Base Voltage............................................................................................ 5 V IC Collector Current............................................................................................................. 10 A Characteristics (Ta=25C) Symbol *BVCEO ICBO IEBO ICEO ICEV *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(sat) *VBE(on)1 *VBE(on)2 VFEC *hFE1 *hFE2 Min. 80 2 100 Typ. Max. 100 2 1 300 2 3 1.5 2 2.8 4.5 3 20 Unit V uA mA mA uA V V V V V V V K Test Conditions IC=200mA VCB=160V VEB=5V VCE=80V VCE=80V, VBE(off)=1.5V IC=5A, IB=10mA IC=10A, IB=100mA IC=5A, IB=2.5mA IC=5A, IB=5mA VCE=3V, IC=5A VCE=3V, IC=10A IC=5A VCE=3V, IC=5A VCE=3V, IC=10A *Pulse Test : Pulse Width 380us, Duty Cycle2% Classification Of VCE(sat)1 Rank VCE(sat)1 KA <1.5V KB <1.1V KC <1.3V Normal <2V HJ10387 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 10000 10000 Spec. No. : HE6028 Issued Date : 1997.06.24 Revised Date : 2001.11.01 Page No. : 2/3 Saturation Voltage & Collector Current Saturation Voltage (mV) 1000 VCE(sat) @ IC=2200IB hFE hFE @ VCE=3V 100 1000 VCE(sat) @ IC=500IB VCE(sat) @ IC=100IB VCE(sat) @ IC=10IB 10 1 1 10 100 1000 10000 100 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) On Voltage & Collector Current 10000 Capacitance & Reverse-Biased Voltage 1000.00 On Voltage (mV) VBE(ON) @ VCE=4V 1000 VBE(ON) @ VCE=3V Capacitance (pF) 100.00 Cob 100 1 10 100 1000 10000 10.00 0.1 1 10 100 Collector Current-IC (mA) Reverse-Biased Voltage (mV) Switching Time & Collector Current 10 VCC=30V, IC=250IB1=250IB2 PT=1ms 100 Safe Operating Area Collector Current-IC (A) Switching Times (us).. 10 PT=100ms PT=1s Tstg 1 Tf Ton 1 0.1 0.1 1 10 0.01 0.1 1 10 100 Collector Current-IC (A) Forward-VCE (V) HJ10387 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-252 Dimension A C Spec. No. : HE6028 Issued Date : 1997.06.24 Revised Date : 2001.11.01 Page No. : 3/3 Marking: HSMC Logo Part Number Date Code Product Series Rank B D L F G Ink Mark Style: Pin 1.Base 2.Collector 3.Emitter 3 H E K 2 I 1 J 3-Lead TO-252 Plastic Surface Mount Package HSMC Package Code: J *: Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2520 0.2677 0.2125 0.2283 Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.40 6.80 5.40 5.80 DIM G H I J K L Inches Min. Max. 0.0866 0.1102 *0.0906 0.0354 0.0315 0.2047 0.2165 0.0551 0.0630 Millimeters Min. Max. 2.20 2.80 *2.30 0.90 0.80 5.20 5.50 1.40 1.60 Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HJ10387 HSMC Product Specification |
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